Ashraf Khan Personal Site

  • (989)-964-4490
  • mkhan126@svsu.edu
  • 7400 Bay Road, University Center, MI 48710
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Dr. M. Ashraf Khan

University OF Notre Dame, South Bend IN Ph.D. in Electrical Engineering

Ph.D. in Electrical Engineering
August, 2014

University Of Tennessee, Knoxville, TN

M.S. in Electrical Engineering
2007

Bangladesh University Of Engineering And Technology University Dhaka, Bangladesh

B.S. in Electrical and Electronic Engineering
2000

Associate Professor, Saginaw Valley State University: August 2022

Current

Courses Taught:

(I) Semiconductor Devices, (II) Electronics II, and Electronics II lab, (III) Electronics I,

(IV) Circuit Theory II, (V) Digital Logic, (VI) Communication Systems, (VII) Senior Design I and

(VIII) Special Studies (graduate class).

  • Developed Electronics II lab
  • Prepared ABET documentation
  • Gained experience in advising and recruitment
  • Supervised undergraduate projects
  • Graded tests and homework for Electromagnetics and Semiconductor Instructor for Electronic Circuits Laboratory. Assisted students to build a radio.
  • Assisted students to program Xilinx FPGAs using VHDL code
  • Taught courses in Semiconductor, Digital electronics, Control Theory, VLSI circuits , and instructed related labs. Supervised numerous undergraduate projects.
Faculty Extern, ENTERGY, PORT GIBSON, MS: June-July, 2019
  • Hard Hat Training on Radiation for Nuclear Power Station
  • Performed Engineering Study at Grand Gulf Nuclear Station
  • RCIC EGM Electronics Replacement with Digital Upgrade, An engineering Study
  • Engaged in design, fabrication, and test of coplanar waveguide interconnects for broadband chip-to- chip communications with very low loss for reliability study.
  • Performed stress based thermo-mechanical failure modeling and simulation in a multilayer interconnect structure with metals, oxide, and semiconductors.
  • Optimized interconnect geometries using simulation in COMSOL and performed simulation to select the proper solders and epoxies for the interconnect.
  • Thermal cycling and shock measurements of interconnect
  • Process optimization of chemical-mechanical polishing, deep reactive ion etching, sputtering and evaporation, electroplating, electroless deposition, and soldering.
  • Designed a 2 GHz high gain microwave amplifier with appropriate matching
  • Fabricated high breakdown diodes and ring oscillators at the Notre Dame nanofabrication
  • Worked with a team of 5 D. researchers, 6 undergraduates, 2 professors, and industry partners.
  • Demonstrated fabrication techniques to group of undergraduate
  • Master’s Project: “Modeling of germinal center reaction for B cells in humoral response with natural

proliferation and selection.”

  • Modeling the human immune response in germinal centers using Matlab to compare feedback loop and open loop reactions and study the death and birth rate of B cells.
  • Digital System Design, Advanced Analog Electronics, Microwave Circuit Design, Electron Microscopy, Integrated Circuit Fabrication, Solid State Devices, Wide Bandgap Device Physics, Microelectronic Materials, Quantum Mechanics, Electromagnetic Theory, Microelectronics, VLSI Design, Microprocessors, Modern Transform Methods, and Digital Signal Processing.
Fabrication:

Wet/Dry Etching, E-Beam and Photolithography, Electroplating, Electroless plating, Wafer Grinding and Lapping, Chemical Mechanical Polishing, Thin Film Deposition (including PVD, PECVD, and E- beam), Oxidation Furnaces, Chemical Etching, and Soldering.

SEM/FIB /X-Ray Systems, Profilometer, Vector Network Analyzer, Oscilloscope, Ellipsometry, Four Point Probe, and Confocal Microscope. 

MS Office, COMSOL, C++, Visual Basic, ADS, HFSS, SPICE, HSPICE, Verilog, VHDL, Cadence, L-Edit, Matlab, Mathematica, Origin, Windows, and Linux.

Journal Papers
  • Ashraf Khan, Brian Maricle, Zachary D. Franzel, Gabe Gransden, Matthew Vannette, Experimental Studies on Partial Energy Harvesting by Novel Solar Cages, Microworlds, to Explore Sustainability. Solar2025, 5, 36. https://doi.org/10.3390/solar5030036
  • Ashraf Khan, Mohammad Islam, Taskin Karim, Mahmoud Manzoul, and Rajani Muraleedharan, “Analytical modeling and verification of a design for an optical assistive system,” International Journal of Applied Science, March 2025.
  • Ashraf Khan, M. Shahidul Islam, Taskin B Karim, and Ursla Offiah, “A special need tool to access keyboard for people with upper limb disability,” Biomedical Sciences Instrumentation, 2019.
  • Ashraf Khan, Quanling Zheng, David Kopp, Wayne Buckhanan, Jason M. Kulick, Patrick Fay, Alfred M. Kriman and Gary H. Bernstein, “Thermal Cycling Study of Quilt Packaging,” J. Electron. Packag.,137(2), 021008 (Jun 01, 2015).
  • Quanling Zheng, David Kopp, Ashraf Khan, Patrick Fay, Alfred M. Kriman, and Gary H. Bernstein, “Investigation of Quilt Packaging Interchip Interconnect with Solder Paste,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, Issue 3, pp. 400-407, 2014.
  • Ashraf Khan, J. M. Kulick, D. P. Kopp, P. Fay, A. M. Kriman, and G. H. Bernstein, “Design and Robustness of Quilt Packaging Superconnect,” Journal of Microelectronics and Electronic Packaging, Vol. 10, No. 1 , 2013.
  • Zheng, M. Ashraf Khan, A. M. Kriman, and G. H. Bernstein, “Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer,” Journal of Microelectronics and Electronic Packaging, Vol. 9, No. 4, 2012.
  • Maniruzzaman, M. S. R. Chowdhury, M. Ashraf Khan, M. S. Ahsan, “An Analytical Model of breakdown in a short channel MOSFET,” Khulna University Studies, 8(1-1563-0897):21-28, 2006/2007.
  • Ashraf Khan, Brian Maricle, Zachary D. Franzel, Gabe Gransden, and Matthew Vannette, “Partial energy harvesting study of solar energy in a microworld by artificial illumination,” International Conference on Sustainable Energy, Smart Cities and Business Intelligence, August 2025, Vancouver, Canada.

 

  • Ashraf Khan, Zachary D. Franzel, Gabe Gransden, Brian Maricle, and Matthew Vannette, “A Study of Illumination Intensity and Energy Harvesting in a Microworld for a Controlled Environment,” 2025 IEEE 68th International Midwest Symposium on Circuits and Systems (MWSCAS), August 2025, Lansing, MI.
  • Ashraf Khan, Gabe Gransden, Zachary D. Franzel, Brian Maricle, and Matthew Vannette, “Solar Energy Harvesting Study Using Solar Cages and Sustainability,” Accepted in 2025 10th International Conference on Sustainable and Renewable Energy Engineering (ICSREE 2025), May, Nice, France.
  • Ashraf Khan, Zachary D. Franzel, Gabe Gransden, Brian Maricle, and Matthew Vannette, “An experimental study of partial energy harvesting by solar cages for sustainability,” ICGEA conference in Singapore, March, 2025.
  • Ashraf Khan, and M. Vannette, Experimental Study of a Solar Cage on Energy Harvest and Unconsumed Energy, 2024 the 8th International Conference on Energy and Environmental Science (ICEES 2024). Environmental Science and Engineering. Springer, Cham. (2024)
  • Ashraf Khan, Yu Zou and Wesley Beck,” A Study on Student Success in Circuit Theory with Complimentary Videotaped Problem-Solving Demonstrations in Challenging Times”, ASEE Conference 2023, June, Baltimore, MD.
  • Gavin M. Zimmer, Yu Zou, Flora Mia Szklenar and Ashraf Khan, “Pb-free solder contact reliability at extreme condition and in phase transition,” The 68th IEEE Holm Conference on Electrical Contacts, October 8-11, 2023, Seattle, WA.
  • A. Khan, Y. Zou, W. Beck, A Study on Student Success in Circuit Theory with Complimentary Videotaped Problem Solving Demonstration in Challenging Times, ASEE 2023 Annual Conference, Baltimore, MD, USA, June 25-28, 2023.
  • Satrudhan Yadav and A. Khan, “A Design and Implementation of a Control Circuit Using a Sensing Network for a Heat Source,” The Asia Pacific Conference on Postgraduate Research in Microelectronics & Electronics, APCCAS 2022, Shenzhen, China. 
  • Waliul Matin, Morrison Michael, and Ashraf Khan, the 66th IEEE Holm Conference on Electrical Contacts, October 24-27, San Antonio, TX, 2021.
  • Ursla Offiah, Taskin B Karim, M. Shahidul Islam, Ashraf Khan, “A special need tool to access keyboard for people with upper limb disability,” 35th Annual Southern Biomedical Engineering Conference, February 22-24, 2019.
  • Daryl Jones, Patresa Cox, Ashraf Khan, “On designing a safe heat source system based on an experimental model of temperature distribution around it,” Mississippi Academy of Sciences, 81st Annual Meeting, February 22-24, 2019.
  • Michael C Ngahane, Aaliyah Sibley, Brian Buford, Lidya Worde, Lashay Williamson, Lufat Rahman, Ashraf Khan, “An Electronic Circuit Design for Child Safety in Cars at Hot Weather,” Mississippi Academy of Sciences, 81st Annual Meeting, February 24, 2017.
  • Bemnet A Tirfagegnehu, Nardos Tadele, Md. Moin Uddin Khan, Gordon Skelton, Ashraf Khan, “An Application of Force Sensitive Resistor, FSR, and Submerging Car’s SOS,” Mississippi Academy of Sciences, 81st Annual Meeting, February 23, 2017.
  • Tankoua, E. Kiros, T. Esatu, F. Seid, M. A. Khan, “An Electronic System for Detecting Lives in Disasters,” Center for Undergraduate Research Conference, Jackson State University, MS, April 14, 2016.
  • Kopp, M. Khan, G. Bernstein, and P. Fay, “Ultra-Broadband Chip-to-Chip Interconnects to

220 GHz for Si-based Millimeter-Wave Systems,” Proc. of International Interconnect Technology Conference, San Jose, 2014.

  • Ashraf Khan, J. M. Kulick, A. M. Kriman, and G. H. Bernstein, “Design and Robustness of Quilt Packaging Superconnect,” Proc. of 45th International Symposium on Microelectronics (IMAPS), San Diego, 2012.
  • Zheng, M. Ashraf Khan, A. M. Kriman and G. H. Bernstein, “Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer,” Proc. of 45th International Symposium on Microelectronics (IMAPS), San Diego, 2012.
  • Ashraf Khan, A. M. Kriman, and G. H. Bernstein, “Thermal Modeling of Quilt Packaging Interconnects,” Proc. Micro/Nano Symposium (UGIM), p. 166-168, West Lafayette, IN, June (2010).
  • Kopp, M. Ashraf Khan, J. Kulick, A. M. Kriman, P. Fay and G. H. Bernstein, “RF and Thermal Testing of Quilt Packaging Systems,” Proc. of the 6th International Conference and Exhibition on Device Packaging (IMAPS), Scottsdale, AZ, (2010).
  • Kopp, M. Ashraf Khan, S. Garvey, K. Anderson, J. Kulick, P. Fay, A. M. Kriman, and G.
  1. Bernstein, “Quilt Packaging: A Coplanar Chip-to-Chip Interconnect Offering Ultra-Wide

Bandwidth,” in Proc. of 2010 International Conference on Compound Semiconductor Manufacturing Technology (CS Mantech), p. 309, Portland, OR (2010).

  • Ashraf Khan, A. Zaman, M. Ferdjallah, “Proposed Model for Skeletal Muscle: Estimation of Fiber Location Using Ultrasonic Effect,” Proc. of IEEE Southeast Conf., p. 341, Richmond, VA (2007).

 

  • Flora Mia Szklenar, Rajani Muraleedharan Sreekumaridevi, Abdullah Almohsin and M. Ashraf Khan, “Circuit Analysis of a Device Combination in an Amplifier,” 2024 IEEE Latin American Electron Devices Conference (LAEDC)Guatemala City, Guatemala, May 8-10, 2024. (Poster)
  • Ashraf Khan, “A Study on Partial Energy Harvesting by a Solar Cage,” 2024 IEEE Latin American Electron Devices Conference (LAEDC)Guatemala City, Guatemala, May 8-10, 2024.
  • Gabe Gransden, Zachary Franzel and M. Ashraf Khan, “Solar Energy and Partial Harvesting Study by a Solar Cage,” MSGC Fall conference October, 2024, Ann Arbor.
  • Flora Mia Szklenar , James Grigg and M. Ashraf Khan, “Circuit design and programming for Hall effect sensor for tactile and non-tactile applications,” UGRP Student showcase, Saginaw Valley State University, 2024.
  • Abdullah Almohsin, and M. Ashraf Khan, “Exploring an application of Hall effect sensor for tactile and non-tactile use,” UGRP Student showcase, Saginaw Valley State University, 2023.
  • Flora Mia Szklenar, Gavin M Zimmer, and M. Ashraf Khan, “Eye diagram and failure of interconnect in microstrip transmission line,” UGRP Student showcase, Saginaw Valley State University, 2023.
  • A. Khan, T. B. Karim, M. S. Islam, and G. Skelton, “Preliminary System Design and Development of a Computer Accessory as an Assistive Tool,” The 7th World Disability and Rehabilitation Conference, 10th– 11th November, 2022.
  • A. Khan, and Alfred M Kriman, “On the selection of inter-chip interconnects materials for electronic chips,” MSGC Virtual Fall Conference, October 2020.
  • Presented in SE&T colloquium series on “Designing an Assistive Tool for People with Upper Extremity Disabilities” on Tuesday, November 12, 2019 at SVSU.
  • Presented research work at HBCU-UCB workshop at University of California, Berkeley in March, 2016.
  • Presented research work and proposal at HBCU-UCB workshop at University of California, Berkeley in February, 2015.
Internal
  • “System design to explore sustainable energy subsequent to solar energy harvesting through solar cage,” Faculty-led Research Grant, Saginaw Valley State University,7/1/24-6/30/2025, $5600
  • “System design to explore sustainable energy subsequent to solar energy harvesting through solar cage,” Faculty Research Grant,” Saginaw Valley State University, 7/1/24-6/30/25, $3,950.
  • “Eye Diagram Utilization in Failures Detection for Electronic Interconnects” Faculty-led Research Grant, Saginaw Valley State University, 8/15/22-8/30/23, $6,500.
  • “Exploring an application of Hall effect sensor for tactile and non-tactile use,” Faculty-led Research Grant, Saginaw Valley State University, 6/15/22-8/30/23, $5,250.
  • “Supporting Student Success and Retention in ECE 235 Circuit Theory by Creating an Archive of Videotaped Problem Solving Demonstrations,” M. Ashraf Khan and Yu Zou, CAI-Dow Professor Award, 5/1/21-4/22/22, $4460.
  • “Electromagnetic Detection of Failures in Electronic Interconnects,” Faculty-led Research Grant, Saginaw Valley State University, 5/10/21-4/30/22, $5,500.
  • “Electromagnetic Detection of Failure in Electronic Interconnects: Reliability of Electrical Interconnects for Space Vehicles,” Faculty Research Grant, Saginaw Valley State University, 7/1/21-6/30/22, $6,680.
  • “Design and implementation of an electronic system for a controlled heat source,” Faculty-led Research Grant, Saginaw Valley State University, 5/10/21-4/30/22, $6,500.
  • “Thermoelectric and Thermomechanical Study of Interconnect Materials Reliability,” Faculty-led Research Grant, Saginaw Valley State University, 8/24/20-5/1/21, $6,000.
  • “Thermoelectric and thermomechanical study of interconnect materials to explore reliability,” Faculty Research Grant, Saginaw Valley State University, 2020, $6500.00.
  • “Thermoelectric and thermomechanical study of interconnect materials reliability”, Faculty-led Research Grant , Saginaw Valley State University, 2020. Awarded $6000.00.
  •  
  • “Electromagnetic Detection of Failure in Electronic Interconnects: Reliability of Electrical Interconnects for Space Vehicles,” Michigan Space Grant Consortium, MSGC Seed Grant, funded by NASA, Spring 2021-Winter 2022, $4,990.
  • “Failures Detection for Electronic Interconnects by Eye Diagram Utilization,” as undergraduate fellowship to Gavin Zimmer under Khan’s supervision, Michigan Space Grant Consortium, MSGC, funded by NASA, Spring 2022-Winter 2023, $4000.
  • “System design to explore sustainable energy subsequent to solar energy harvesting through solar cage,” as undergraduate fellowship to Gabe Gransden under Khan’s supervision, Michigan Space Grant Consortium, MSGC, funded by NASA, Spring 2024-Winter 2025, $4000.
  • “Equipment Investment and Student Projects on Vehicle Safety at Jackson State University,” DENSO North America Foundation, April 2019, awarded Grant of $40,000.00 in Jackson State University.
  •  “Disability Mat” – JSU I-Corps Site, NSF, 2018, awarded Mini grant.
  • A proposal on “Modeling and Simulation of Launch vehicle with the focus of impact of reuse to lifetime” was submitted to The United Engr. Service Group (UESG). February, 2019.
Community Service
  • Presenter in GM WiE, 2023;
  • Judge in 2021 Michigan Regional Future City Competition,
  • Served as a judge in SASA Science Fair Saginaw Arts & Sciences Academy, Saturday, Feb 8, 2020
  • Served as a judge, Michigan Regional Science Bowl, Saginaw Valley State University Saturday, February 22, 2020
  •  
  • ECE Program Assessment Coordinator 2024-current,
  • Faculty Evaluation committee 2022-current,
  • Chrysalis Scholarship Committee, 2023, 2022, 2021;
  • Cardinal College Day, Fall 2023, 2022, 2021,2019 Winter 2022, 2021;
  • Colloquium Task Force, 2021-22;
  • Youth Ambassadors Program, 2021;
  • Student Conduct Board, 2021;
  • Evaluator, Saltzman Award, 2021;
  • Student Advisor, Fall 2020-current;
  • Fresh Start, Fall 2020-current
  • Open House, 2019-current.
  • Student Advisor, Fall 2020-current
  • Grade grievance committee, Fall 2020
  • MSGC (NASA) board member, 2023-current  (Provide a link)
  • Development of Computer Engineering Program at SVSU, 2021.
  • Biomedical Engineering program coordinator, 2018-2019.
  • A PhD dissertation committee member, 2018-
  • Electrical and Computer Engineering Undergraduate Curriculum committee member 2015, 2016 , 2017, and 2019.
  • Distance Learning committee member 2015, 2016 and
  • INCLUDES- AASD-STEM, Senior Personnel, 2017.
  • Biomedical Engineering Steering Committee member,
  • IEEE SoutheastCon 2024
  • ICSREE 2025
  • ASEE 2023
  • IEEE SoutheastCon 2025
  • ASEE 2025
  • IEEE SoutheastCon 2024
  • MSGC grant application reviewer
  • IEEE Transactions on Components, Packaging and Manufacturing Technology.
  • MDPI, Materials ( Open Access Materials Science Journal ).
  • MDPI, Metals ( Open Access Materials Science Journal ).
  • MDPI, Applied Sciences (Open Access Journal ).
  • Editorial board member, Academic Journal of Engineering Sciences (AJES).
ProfessionalDevelopmentActivities
  • ABET Symposium, 2025
  • Building Supporting Communities, January,2022;
  • Adult Mental Health First Aid USA, August, 2021;
  • Training on online and hybrid courses, July-August, 2020
  • Implicit Bias Think Tank, March 22-23, 2017
  • Training on grant writing, 2016-2017
  • Teaching Method workshop, 2015
Current Membership in Professional Organization
  • IEEE
  • IEEE Electronics Packaging Society
  • Rehabilitation Engineering & Assistive Technology Society of North America
  • UGRP Faculty Mentor Award 2022
  • 5 UGRP grants 2020-25
  • 4 FRG grants 2020-25
  • MSGC Seed grant 2021-2022
  • DENSO grant 2019-2020
  • Disability Mat” - JSU I-Corps Site, NSF, 2018
  • Academy of Research and Scholarly Engagement Scholar, Jackson State University 2016-2017
  • Professional development award from Notre Dame graduate school 2012
  • Outstanding graduate teaching assistant award, Kaneb Center, University of Notre Dame 2008
  • Fellowship, University of Notre Dame 2007-2008
  • Dean’s list during my undergraduate study 1998-1999
  • Board Scholarship for outstanding results in Higher Secondary Certificate Exam, Bangladesh 1995-2000

Assistive technology Design

Microelectronic Reliability of Quilt Packaging

solar-cage

Solar Cage for Sustainable Renewable Energy Harvesting