There are traditional electronic packaging methods that include ‘Thru Silicon Via’, ball grid array, and flip chip. QP superconnect is one emerging method for electronic interconnect and is included in International Technology Roadmap for Semiconductors, ITRS. QP is a 2- dimensional chip packaging for coplanar waveguide. For the interchip interconnects, both simulation and experimental results are available for a wide frequency range, focusing on the performance of working structures. Thermomechanical experiments were done as well.